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 Si1029X
Vishay Siliconix
Complementary N- and P-Channel 60-V (D-S) MOSFET
PRODUCT SUMMARY
VDS (V) N-Channel 60 RDS(on) () 1.40 at VGS = 10 V 3 at VGS = 4.5 V 4 at VGS = - 10 V 8 at VGS = - 4.5 V ID (mA) 500 200 - 500 - 25
FEATURES
* * * * * Halogen-free Option Available TrenchFET(R) Power MOSFETs Very Small Footprint High-Side Switching Low On-Resistance: N-Channel, 1.40 P-Channel, 4 * Low Threshold: 2 V (typ.) * Fast Switching Speed: 15 ns (typ.) * Gate-Source ESD Protected: 2000 V
RoHS
COMPLIANT
P-Channel
- 60
BENEFITS
* * * *
6 D1
SC-89
S1 1
Ease in Driving Switches Low Offset (Error) Voltage Low-Voltage Operation High-Speed Circuits
APPLICATIONS
G1 2 5 G2 Marking Code: H
D2
3
4
S2
* Replace Digital Transistor, Level-Shifter * Battery Operated Systems * Power Supply Converter Circuits
Top View Ordering Information: Si1029X-T1-E3 (Lead (Pb)-free) SI1029X-T1-GE3 (Lead (Pb)-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS TA = 25 C, unless otherwise noted
N-Channel Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 150 C)a Pulsed Drain Currentb TA = 25 C TA = 85 C TA = 25 C TA = 85 C Symbol VDS VGS ID IDM IS PD TJ, Tstg ESD 450 280 145 320 230 650 380 250 130 - 55 to 150 2000 - 450 280 145 305 220 5s Steady State 60 20 - 200 - 145 - 650 - 380 250 130 mW C V - 190 - 135 mA 5s P-Channel Steady State - 60 Unit V
Continuous Source Current (Diode Conduction)a Maximum Power Dissipationa
Operating Junction and Storage Temperature Range Gate-Source ESD Rating (HBM, Method 3015) Notes: a. Surface Mounted on FR4 board. b. Pulse width limited by maximum junction temperature.
Document Number: 71435 S-80643-Rev. B, 24-Mar-08
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Si1029X
Vishay Siliconix
SPECIFICATIONS TJ = 25 C, unless otherwise noted
Parameter Static Drain-Source Breakdown Voltage Gate Threshold Voltage V(BR)DSS VGS(th) VGS = 0 V, ID = 10 A VGS = 0 V, ID = - 10 A VDS = VGS, ID = 250 A VDS = VGS, ID = - 250 A VDS = 0 V, VGS = 5 V Gate-Body Leakage IGSS VDS = 0 V, VGS = 10 V VDS = 50 V, VGS = 0 V VDS = - 50 V, VGS = 0 V VDS = 50 V, VGS = 0 V, TJ = 85 C VDS = - 50 V, VGS = 0 V, TJ = 85 C VDS = 10 V, VGS = 4.5 V VDS = - 10 V, VGS = - 4.5 V VDS = 7.5 V, VGS = - 4.5 V VDS = - 10 V, VGS = - 10 V VGS = 4.5 V, ID = 200 mA VGS = - 4.5 V, ID = - 25 mA VGS = 10 V, ID = 500 mA VGS = - 10 V, ID = - 500 mA VGS = 10 V, ID = 500 mA, TJ = 125 C VGS = - 10 V, ID = - 500 mA, TJ = 125 C VDS = 10 V, ID = 200 mA VDS = - 10 V, ID = - 100 mA IS = 200 mA, VGS = 0 V IS = - 200 mA, VGS = 0 V N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch 60 - 60 1 -1 Symbol Test Conditions Min. Typ. Max. Unit
Zero Gate Voltage Drain Current
IDSS
2.5 - 3.0 50 100 150 200 10 - 25 100 - 250
V
nA
On-State Drain Currenta
ID(on)
500 - 50 800 - 600 3 8 1.40 4 2.50 6 200 100 1.4 - 1.4 750 1700 75 260 225 460 30 23 6 10 3 5 15 20
mA
Drain-Source On-State Resistancea
RDS(on)
Forward Transconductancea Diode Forward Voltagea Dynamicb Total Gate Charge Gate-Source Charge Gate-Drain Charge Input Capacitance Output Capacitance Reverse Transfer Capacitance
gfs VSD
ms V
Qg Qgs Qgd Ciss Coss Crss tON
N-Channel VDS = 10 V, VGS = 4.5 V, ID = 250 mA P-Channel VDS = - 30 V, VGS = - 15 V, ID = - 500 mA
pC
N-Channel VDS = 25 V, VGS = 0 V, f = 1 MHz P-Channel VDS = - 25 V, VGS = 0 V, f = 1 MHz N-Channel VDD = 30 V, RL = 150 ID 200 mA, VGEN = 10 V, RG = 10 P-Channel VDD = - 25 V, RL = 150 ID - 165 mA, VGEN = - 10 V, RG = 10
pF
Turn-On Timec
ns 20 35
Turn-Off
Timec
tOFF
Notes: a. Pulse test; pulse width 300 s, duty cycle 2 %. b. Guaranteed by design, not subject to production testing. c. Switching time is essentially independent of operating temperature.
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
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Document Number: 71435 S-80643-Rev. B, 24-Mar-08
Si1029X
Vishay Siliconix
N-CHANNEL TYPICAL CHARACTERISTICS TA = 25 C, unless otherwise noted
1.0 6V VGS = 10 thru 7 V 0.8 I D - Drain Current (A) 5V I D - Drain Current (mA) 900 25 C 125 C 600 TJ = - 55 C 1200
0.6 4V 0.4
300 0.2 3V 0.0 0 1 2 3 4 5 0 0 1 2 3 4 5 6
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
Output Characteristics
4.0 3.5 R DS(on) - On-Resistance ( ) 40 3.0 2.5 2.0 1.5 1.0 10 0.5 0.0 0 200 400 600 800 1000 0 0 5 Crss VGS = 4.5 V VGS = 10 V C - Capacitance (pF) 30 50
Transfer Characteristics
VGS = 0 V f = 1 MHz
Ciss 20 Coss
10
15
20
25
I D - Drain Current (mA)
V DS - Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current
7 6 5 4 3 2 1 0 0.0 0.0 - 50 VDS = 10 V ID = 250 mA R DS(on) - On-Resistance 2.0
Capacitance
VGS - Gate-to-Source Voltage (V)
VGS = 10 V at 500 mA 1.6
(Normalized)
1.2
VGS = 4.5 V at 200 mA
0.8
0.4
0.1
0.2
0.3
0.4
0.5
0.6
- 25
0
25
50
75
100
125
150
Qg - Total Gate Charge (nC)
TJ - Junction Temperature (C)
Gate Charge
On-Resistance vs. Junction Temperature
Document Number: 71435 S-80643-Rev. B, 24-Mar-08
www.vishay.com 3
Si1029X
Vishay Siliconix
N-CHANNEL TYPICAL CHARACTERISTICS TA = 25 C, unless otherwise noted
1000 VGS = 0 V R DS(on) - On-Resistance ( ) 4 5
I S - Source Current (A)
100 TJ = 125 C
3
2 ID = 200 mA
ID = 500 mA
10
TJ = 25 C
1
TJ = - 55 C 1 0.00 0.3 0.6 0.9 1.2 1.5 0 0 2 4 6 8 10
VSD - Source-to-Drain Voltage (V)
VGS - Gate-to-Source Voltage (V)
Source-Drain Diode Forward Voltage
0.4
On-Resistance vs. Gate-to-Source Voltage
0.2 ID = 250 A V GS(th) Variance (V) 0.0
- 0.2
- 0.4
- 0.6
- 0.8 - 50
- 25
0
25
50
75
100
125
150
TJ - Junction Temperature (C)
Threshold Voltage Variance Over Temperature
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Document Number: 71435 S-80643-Rev. B, 24-Mar-08
Si1029X
Vishay Siliconix
P-CHANNEL TYPICAL CHARACTERISTICS TA = 25 C, unless otherwise noted
1.0 VGS = 10 V 7V 0.8 I D - Drain Current (A) 8V I D - Drain Current (mA) 900 25 C 125 C 600 6V 1200 TJ = - 55 C
0.6
0.4 5V 0.2 4V 0.0 0 1 2 3 4 5
300
0 0 2 4 6 8 10
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
Output Characteristics
20 40
Transfer Characteristics
VGS = 0 V R DS(on) - On-Resistance ( ) 16 VGS = 4.5 V C - Capacitance (pF) 32 Ciss 24
12 VGS = 5 V 8 VGS = 10 V
16 Coss 8 Crss
4
0 0 200 400 600 800 1000
0 0 5 10 15 20 25
I D - Drain Current (mA)
V DS - Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current
15 ID = 500 mA VGS - Gate-to-Source Voltage (V) 12 R DS(on) - On-Resistance VDS = 30 V VDS = 48 V 9 1.8
Capacitance
1.5 VGS = 10 V at 500 mA 1.2 (Normalized) VGS = 4.5 V at 25 mA
0.9
6
0.6
3
0.3
0 0.0
0.3
0.6
0.9
1.2
1.5
1.8
0.0 - 50
- 25
0
25
50
75
100
125
150
Q g - Total Gate Charge (nC)
TJ - Junction Temperature (C)
Gate Charge
On-Resistance vs. Junction Temperature
Document Number: 71435 S-80643-Rev. B, 24-Mar-08
www.vishay.com 5
Si1029X
Vishay Siliconix
P-CHANNEL TYPICAL CHARACTERISTICS TA = 25 C, unless otherwise noted
1000 VGS = 0 V R DS(on) - On-Resistance ( ) 8 ID = 500 mA 10
I S - Source Current (A)
100 TJ = 125 C
6
4 ID = 200 mA 2
10
TJ = 25 C
TJ = - 55 C 1 0.00 0.3 0.6 0.9 1.2 1.5 0 0 2 4 6 8 10
VSD - Source-to-Drain Voltage (V)
VGS - Gate-to-Source Voltage (V)
Source-Drain Diode Forward Voltage
0.5 0.4 0.3 VGS(th) Variance (V) 0.2 0.1 0.0 - 0.1 - 0.2 - 0.3 - 50
On-Resistance vs. Gate-to-Source Voltage
ID = 250 A
- 25
0
25
50
75
100
125
150
TJ - Junction Temperature (C)
Threshold Voltage Variance Over Temperature
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Document Number: 71435 S-80643-Rev. B, 24-Mar-08
Si1029X
Vishay Siliconix
N- OR P-CHANNEL TYPICAL CHARACTERISTICS TA = 25 C, unless otherwise noted
2 Normalized Effective Transient Thermal Impedance 1 Duty Cycle = 0.5
0.2
Notes:
0.1 0.1 0.05
PDM t1
0.02
t2 1. Duty Cycle, D =
t1 t2 2. Per Unit Base = RthJA = 500 C/W
Single Pulse 0.01 10 -4 10 -3 10 -2 10 -1 1 Square Wave Pulse Duration (s)
3. TJM - TA = PDMZthJA(t) 4. Surface Mounted
10
100
600
Normalized Thermal Transient Impedance, Junction-to-Ambient
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see http://www.vishay.com/ppg?71435.
Document Number: 71435 S-80643-Rev. B, 24-Mar-08
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Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, "Vishay"), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000 Revision: 18-Jul-08
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